february 2010 doc id 6115 rev 7 1/10 10 stps2h100 power schottky rectifier features negligible switching losses high junction temperature capability low leakage current good trade-off between leakage current and forward voltage drop avalanche capability specified description schottky rectifiers designed for high frequency miniature switched mode power supplies such as adaptators and on board dc/dc converters. available in sma, smb, low-profile smb. table 1. device summary symbol value i f(av) 2 a v rrm 100 v t j (max) 175 c v f (max) 0.65 v k a sma stps2h100a smb stps2h100u k a k a smb flat stps2h100uf www.st.com
characteristics stps2h100 2/10 doc id 6115 rev 7 1 characteristics table 2. absolute ratings (limiting values) symbol parameter value unit v rrm repetitive peak reverse voltage 100 v i f(av) average forward current sma / smb t l = 130 c = 0.5 2a smb flat t l = 150 c = 0.5 i fsm surge non repetitive forward current t p =10 ms sinusoidal 75 a p arm repetitive peak avalanche power t p = 1 s t j = 25 c 2400 w t stg storage temperature range -65 to + 175 c t j operating junction temperature (1) 175 c 1. condition to avoid thermal r unaway for a diode on its own heatsink dptot dtj < 1 rth(j-a) table 3. thermal resistance symbol parameter value unit r th(j-l) junction to lead sma 30 c/w smb 25 smb flat 15 table 4. static electrical characteristics symbol parameter test conditions min. typ. max. unit i r (1) reverse leakage current t j = 25 c v r = v rrm 1a t j = 125 c 0.4 1 ma v f (2) forward voltage drop t j = 25 c i f = 2 a 0.79 v t j = 125 c 0.6 0.65 t j = 25 c i f = 4 a 0.88 t j = 125 c 0.69 0.74 1. pulse test: tp = 5 ms, < 2% 2. pulse test: tp = 380 s, < 2% to evaluate the conduction losses use the following equation: p = 0.56 x i f(av) + 0.045 i f 2 (rms)
stps2h100 characteristics doc id 6115 rev 7 3/10 figure 1. average forward power dissipation versus average forward current figure 2. average forward current versus ambient temperature ( = 0.5) (sma / smb) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 p (w) f(av) t =tp/t tp = 1 = 0.1 = 0.05 i (a) f(av) = 0.5 = 0.2 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 0 25 50 75 100 125 150 175 i (a) f(av) t =tp/t tp smb r =80c/w s =1.5cm th(j-a) (cu) 2 t (c) amb r=r th(j-a) th(j-i) sma r =100c/w s =1.5cm th(j-a) (cu) 2 sma smb figure 3. average forward current versus ambient temperature ( = 0.5) (smb flat) figure 4. normalized avalanche power derating versus pulse duration 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 0 25 50 75 100 125 150 175 smb flat r=r th(j-a) th(j-l) r =40c/w . s =2.5 cm th(j-a) cu 2 i (a) f(av) t =tp/t tp t (c) amb 0.001 0.01 0.1 0.01 1 0.1 10 100 1000 1 t (s) p p(t p ) p (1 s) arm arm figure 5. normalized avalanche power derating versus junction temperature figure 6. non repetitive surge peak forward current versus overload duration (maximum values) (sma) 0 0.2 0.4 0.6 0.8 1 1.2 25 50 75 100 125 150 t (c) j p(t j ) p (25 c) arm arm 0 1 2 3 4 5 6 7 8 9 10 1.e-03 1.e-02 1.e-01 1.e+00 i (a) m i m t =0.5 t(s) t =125c a t =25c a t =75c a sma
characteristics stps2h100 4/10 doc id 6115 rev 7 figure 7. non repetitive surge peak forward current versus overload duration (maximum values) (smb) figure 8. non repetitive surge peak forward current versus overload duration (maximum values) (smb flat) 0 1 2 3 4 5 6 7 8 9 10 1.e-03 1.e-02 1.e-01 1.e+00 i (a) m i m t =0.5 t(s) t =125c a t =25c a t =75c a smb 0 5 10 15 20 25 30 1.e-03 1.e-02 1.e-01 1.e+00 i (a) m i m t =0.5 t(s) t =125c l t =25c l t =75c l smb flat figure 9. relative variation of thermal impedance junction to ambient versus pulse duration (sma / smb) figure 10. relative variation of thermal impedance junction to lead versus pulse duration (smb flat) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-02 1.e-01 1.e+00 1.e+01 1.e+02 1.e+03 z/r th(j-a) th(j-a) t =tp/t tp t (s) p single pulse sma smb 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-04 1.e-03 1.e-02 1.e-01 1.e+00 1.e+01 smb flat (non exposed pad) z/r th(j-l) th(j-l) t (s) p single pulse figure 11. reverse leakage current versus reverse voltage applied (typical values) figure 12. junction capacitance versus reverse voltage applied (typical values) 1.e-02 1.e-01 1.e+00 1.e+01 1.e+02 1.e+03 1.e+04 0 20406080100 t j =150c t j =125c t j =25c t j =100c t j =75c t j =50c v (v) r i (a) r 10 100 1 10 100 c(pf) v (v) r f=1mhz v =30mv t =25c osc rms j
stps2h100 characteristics doc id 6115 rev 7 5/10 figure 17. thermal resistance junction to ambient versus copper surface under each lead (smb flat) figure 13. forward voltage drop versus forward current (low level) figure 14. forward voltage drop versus forward current (high level) i (a) fm 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 t j =25c (maximum values) t j =125c (maximum values) t j =125c (maximum values) t j =125c (typical values) t j =125c (typical values) v (v) fm i (a) fm 1 10 100 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 t j =25c (maximum values) t j =125c (maximum values) t j =125c (maximum values) t j =125c (typical values) t j =125c (typical values) v (v) fm figure 15. thermal resistance junction to ambient versus copper surface under each lead (sma) figure 16. thermal resistance junction to ambient versus copper surface under each lead (smb) 0 10 20 30 40 50 60 70 80 90 100 110 120 130 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 r (c/w) th(j-a) s (cm2) cu sma epoxy printed circuit board fr4, copper thickness = 35 m 0 10 20 30 40 50 60 70 80 90 100 110 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 r (c/w) th(j-a) s (cm2) cu smb epoxy printed circuit board fr4, copper thickness = 35 m 0 10 20 30 40 50 60 70 80 90 100 110 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 r (c/w) th(j-a) s (cm2) cu smb flat epoxy printed circuit board fr4, copper thickness = 35 m
package information stps2h100 6/10 doc id 6115 rev 7 2 package information epoxy meets ul94, v0 lead-free package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 18. sma footprint (dimensions in mm) table 5. sma dimensions ref. dimensions millimeters inches min. max. min. max. a1 1.90 2.45 0.075 0.094 a2 0.05 0.20 0.002 0.008 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.006 0.016 d 2.25 2.90 0.089 0.114 e 4.80 5.35 0.189 0.211 e1 3.95 4.60 0.156 0.181 l 0.75 1.50 0.030 0.059 e c l e1 d a1 a2 b 2.63 5.43 1.4 1.64 1.4
stps2h100 package information doc id 6115 rev 7 7/10 figure 19. smb footprint (dimensions in mm) table 6. smb dimensions ref. dimensions millimeters inches min. max. min. max. a1 1.90 2.45 0.075 0.096 a2 0.05 0.20 0.002 0.008 b 1.95 2.20 0.077 0.087 c 0.15 0.40 0.006 0.016 e 5.10 5.60 0.201 0.220 e1 4.05 4.60 0.159 0.181 d 3.30 3.95 0.130 0.156 l 0.75 1.50 0.030 0.059 e c l e1 d a1 a2 b 2.60 5.84 1.62 2.18 1.62
package information stps2h100 8/10 doc id 6115 rev 7 figure 20. smb flat footprint (dimensions in mm) table 7. smb flat dimensions ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.90 1.10 0.035 0.043 b (1) 1. applies to plated leads 1.95 2.20 0.077 0.087 c (1) 0.15 0.40 0.006 0.016 d 3.30 3.95 0.130 0.156 e 5.10 5.60 0.200 0.220 e1 4.05 4.60 0.189 0.181 l 0.75 1.50 0.029 0.059 l1 0.40 0.016 l2 0.60 0.024 d a l l l1 l2 e e1 b c 1.20 1.20 3.44 5.84 2.07
stps2h100 ordering information doc id 6115 rev 7 9/10 3 ordering information 4 revision history table 8. ordering information order code marking package weight base qty delivery mode stps2h100a s21 sma 0.068 g 5000 tape and reel stps2h100u g21 smb 0.107 g 2500 tape and reel stps2h100uf fg21 smb flat 0.050 g 5000 tape and reel table 9. document revision history date revision changes jul-2003 4a last update. aug-2004 5 sma package dimensions update. reference a1 max. changed from 2.70 (0.106 inches) to 2.03 mm (0.080 inches). 08-feb-2007 6 reformatted to current standards. added ecopack statement. added smb flat package. 15-feb-2010 7 updated weight for smb flat in table 8.
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